|
Features |
Standard |
Advanced |
|
Max. layers count |
12 |
16 |
|
Min. track width / spacing |
76/76 |
50/76 |
|
Min. board thickness (mm) |
0.30 |
0.20 |
|
Max. board thickness (mm) |
6.0 |
10 |
|
Max. copper thickness |
3oz (Internal) and 6oz (external) |
12oz (external) |
|
Min. core thickness (um) |
100 |
100 |
|
Min. copper thickness |
1/3oz |
- |
|
Max. panel size (mm) |
550x650 |
550x1500 |
|
Layer to layer registration (um) |
+/-100 |
+/-76 |
|
Min. drilled hole size (um) |
100 |
100 |
|
Plated hole tolerance (mm) |
+/-0.075 |
+/-0.05 |
|
Min. laser drilled hole (um) |
100 |
75 |
|
Pad size over drilled hole size (um) |
250 |
200 |
|
Aspect ratio |
8:1 |
12:1 |
|
Controlled Impedance |
+/-10% |
+/-8% |
|
Min. Solder resist dam (um) |
100 |
76 |
|
Solder resist registration (um) |
+/-76 |
+/-50 |
|
HDI / Buried - blind via |
Yes |
Yes |
|
Resin via filled and capped |
Yes |
Yes |
|
Copper via filled for blind |
Yes |
Yes |
|
Copper via filled through hole |
Yes |
Yes |
|
Level of blind via / HDI |
1 |
2 |
|
Flexible |
Yes |
Yes |
|
Semi-flex |
Yes |
Yes |
|
Rigid-flex |
Yes |
Yes |
|
Depth control routing (PTH/NPTH) |
Yes |
Yes |
|
Countersink |
Yes |
Yes |
|
Beveling |
Yes |
Yes |